Title:
MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC EQUIPMENT PROVIDED THEREWITH
Document Type and Number:
Japanese Patent JP3782577
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To realize a multilayer printed wiring board provided with a structure which can stabilize the potential of the grounding pattern of the printed wiring board and restrains radiation noises caused by standing waves or the like.
SOLUTION: This wiring board is equipped with a first conductive layer 1 where a signal conductor pattern and a grounding conductor pattern are mixedly present and a second conductive layer 4 formed of a conductor equal to the printed wiring board in plane area through the intermediary of an insulating layer, wherein only the grounding conductor pattern 3 out of the conductor patterns 2 and 3 of the first conductive layer 1 is electrically connected to the second conductive layer 4 through the intermediary of a circuit device 5 of certain impedance. It is preferable that the circuit device 5 is connected at a single point, varied in impedance characteristics with frequency, and composed of a resistive, capacitive, and inductive properties are mode singly or combined by to be formed as a circuit device group.
Inventors:
Satoshi Sugimoto
Application Number:
JP10516598A
Publication Date:
June 07, 2006
Filing Date:
April 15, 1998
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L23/12; H05K3/46; (IPC1-7): H01L23/12
Domestic Patent References:
| JP1012980A | ||||
| JP9199818A | ||||
| JP9139573A | ||||
| JP11259172A |
Attorney, Agent or Firm:
Akio Miyazaki
Shinichi Iwata
Masaaki Ogata
Nobuyuki Kaneda
Ishibashi Masayuki
Katsuhiro Ito
Shinichi Iwata
Masaaki Ogata
Nobuyuki Kaneda
Ishibashi Masayuki
Katsuhiro Ito