Title:
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP3440174
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable high density mounting of high reliability and quality by reducing warpage and twisting of the board.
SOLUTION: First, an insulating layer of mixture is formed on one side of a separating film 20. Next, through holes 21 are formed in desired positions on the separating film 20 with a mixture layer 10. Then, the through holes 21 are filled with conductive paste 14. The separating film 20 filled with conductive paste 14 is joined to one side or the both sides of a printed wiring board 1 including at least two layers of wiring patterns. Next, the separating film 20 on the printed wiring board 1 is separated. Then a copper foil 26 is provided on the surface of the printed wiring board 1 and bonded by setting the thermosetting resin in the mixture layer 10 and the conductive paste 14 by heating and pressing. Further, the printed wiring board 1 is multilayered by patterning the copper foil 26 on its surface. The above operations are repeated to realize a simple lamination.
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Inventors:
Seiichi Nakatani
Application Number:
JP30556895A
Publication Date:
August 25, 2003
Filing Date:
November 24, 1995
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Domestic Patent References:
| JP7283534A | ||||
| JP7226591A | ||||
| JP5110263A | ||||
| JP6268345A | ||||
| JP7263828A |
Attorney, Agent or Firm:
Mitsutake Murayama
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