Title:
MULTILAYER PRINTED WIRING BOARD AND PACKAGE BOARD
Document Type and Number:
Japanese Patent JP2001339165
Kind Code:
A
Abstract:
To provide a multilayer printed wiring board in which electrical connection can be made directly with an IC chip not through a lead part.
The multilayer printed wiring board previously incorporates an IC chip 20 in a core substrate 30 and a transition layer 38 is arranged on the die pad 24 of the IC chip 20. Consequently, electrical connection can be made between the IC chip and the multilayer printed wiring board without requiring any lead part or sealing resin. Since the transition layer 38 is provided on the die pad 24, a build-up layer can be stacked even if the die pad 24 has a fine pitch (150 μm) and/or a small size (20 μm or less) while enhancing connectability and reliability of the die pad 24 and via holes 60.
Inventors:
SAKAMOTO HAJIME
SUGIYAMA SUNAO
O TOUTO
SUGIYAMA SUNAO
O TOUTO
Application Number:
JP2000388457A
Publication Date:
December 07, 2001
Filing Date:
December 21, 2000
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46; H01L23/12; (IPC1-7): H05K3/46; H01L23/12
Domestic Patent References:
| JPH10189635A | 1998-07-21 | |||
| JPH11145174A | 1999-05-28 | |||
| JPH09321408A | 1997-12-12 | |||
| JPH11233678A | 1999-08-27 | |||
| JPH10321634A | 1998-12-04 | |||
| JPH05160588A | 1993-06-25 | |||
| JPH08255855A | 1996-10-01 | |||
| JPH04154197A | 1992-05-27 | |||
| JPH11220262A | 1999-08-10 |
Attorney, Agent or Firm:
Akito Tagashita (1 person outside)
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