Title:
MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2006278718
Kind Code:
A
Abstract:
To obtain a multilayer printed wiring board capable of removing high-frequency noise effectively, and also suppressing the addition of components, such as EMI-countermeasure components.
A through-hole penetrating the surface and the rear is provided in a multilayer printed wiring board, and the through-hole is filled with an insulating soft magnetism compound object 2. Furthermore, a through-hole 3 is provided in the insulating soft magnetism compound object 2. This through-hole 3 and a circuit pattern 4 are connected, and wiring used as an object for suppressing noise is connected to the circuit pattern 4.
Inventors:
NISHI SHINYA
Application Number:
JP2005095492A
Publication Date:
October 12, 2006
Filing Date:
March 29, 2005
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K3/46; H05K1/11
Domestic Patent References:
| JPH08111588A | 1996-04-30 | |||
| JPH0983104A | 1997-03-28 | |||
| JPS4967946U | 1974-06-13 | |||
| JPH05167262A | 1993-07-02 | |||
| JPH01312885A | 1989-12-18 | |||
| JP2003209331A | 2003-07-25 | |||
| JPH02181961A | 1990-07-16 | |||
| JPH0637416A | 1994-02-10 | |||
| JPH06338687A | 1994-12-06 | |||
| JP2004327690A | 2004-11-18 |
Attorney, Agent or Firm:
Hiroaki Tazawa
Konobu Kato
Hideaki Tazawa
Hamada Hatsune
Konobu Kato
Hideaki Tazawa
Hamada Hatsune