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Title:
MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH04282894
Kind Code:
A
Abstract:

PURPOSE: To reduce the anisotropy of change in size and to increase a dimension al accuracy by laminating inner boards and outer boards so that warp and weft of glass cloth contained in the inner and outer boards may make an angle of 45° with each other.

CONSTITUTION: A prepreg is a glass cloth board which is semicured after it is impregnated with thermosetting resin. A first prepreg 1 is made by cutting the prepreg along warp and weft of the glass cloth. A second prepreg 2 is made by cutting the prepreg in such directions as to make an angle of 45° with warp and weft of the glass cloth. The first and second prepregs 1 and 2 are laminated alternately. Then, a copper foil 3 is stuck on each face of this laminate by thermocompression and the copper foils 3 are patterned. Thus, an inner board 4 is obtained. In like manner, an outer board 5 is obtained. The outer board 5 is located on each face of the inner board 4 with the prepreg 2 put between and all these are bonded by thermocompression to be made into one body. Thus, a multilayer printed wiring board is formed.


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Inventors:
Sumi, Shinji
Application Number:
JP1991000043905
Publication Date:
October 07, 1992
Filing Date:
March 11, 1991
Export Citation:
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Assignee:
NEC CORP
International Classes:
D03D25/00; H05K1/03; H05K3/46; (IPC1-7): D03D25/00; H05K1/03; H05K3/46



 
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