Title:
多層体、レジストパターン形成方法、微細加工パターンを有する装置の製造方法および電子装置
Document Type and Number:
Japanese Patent JP4606136
Kind Code:
B2
Abstract:
Technologies to form fine resist patterns consistently by solving the problem of poor patterning influenced by a resist-protecting film, are provided. A layer made of a resist (resist layer) is formed on a substrate, a resist-protecting film comprising an antistatic resin and a photo-acid generating agent is formed on the resist layer, and active-energy rays are selectively irradiated over the resist-protecting film, so that a resist pattern is formed by developing the resist.
Inventors:
Junichi now
Application Number:
JP2004337249A
Publication Date:
January 05, 2011
Filing Date:
November 22, 2004
Export Citation:
Assignee:
富士通株式会社
International Classes:
G03F7/11; G03F7/09; G03F7/095; H01L21/027
Domestic Patent References:
| JP7295228A | ||||
| JP7140668A | ||||
| JP11153871A | ||||
| JP6110214A | ||||
| JP4032848A | ||||
| JP7168367A |
Attorney, Agent or Firm:
Kenji Doi
Hayashi Tsunetoku
Hayashi Tsunetoku