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Patent Searching and Data


Title:
MULTILAYER SHEET COIL AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH09199329
Kind Code:
A
Abstract:

To simplify manufacturing processes and reduce manufacturing costs by using the exposed conductor layer inside a through hole as a multilayer sheet coil connecting terminal.

A multilayer sheet coil 16 is formed by integratedly laminating a first coil base plate and a second coil base plate. A recessed part having a semicircular cross section is provided in the side surfaces of the integratedly stacked first coil base plate and second coil base plate. A conductor layer is formed in the inner wall of the recessed part and electrically connected to a lead pattern 6. The conductor layer in the inner wall of the recessed part is used as connection terminals 17, 18. The laminated sheet coil 16 is connected by soldering to the predetermined circuit terminal of a printed circuit board on which the multilayer sheet coil 16 is mounted through the connection terminals 17, 18, electrically connected to a predetermined circuit and at the same time fixed to the surface of the printed circuit board.


Inventors:
TAKAHASHI SEIICHI
Application Number:
JP866396A
Publication Date:
July 31, 1997
Filing Date:
January 22, 1996
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H01F27/28; H01F17/00; H01F41/04; H01F41/10; (IPC1-7): H01F17/00; H01F27/28; H01F41/04; H01F41/10