Title:
多層ストリップライン・アセンブリの相互接続及び相互接続方法
Document Type and Number:
Japanese Patent JP4463102
Kind Code:
B2
Abstract:
A multi-layer stripline assembly interconnection includes a first stripline sub-assembly having a first surface and a first plurality of vias disposed in the first surface adapted to receive a plurality of solid metal balls. The interconnection further includes a second stripline sub-assembly having a second plurality of vias disposed in the first surface of the second sub-assembly adapted to be aligned with the first plurality of vias. Reflowed solder is wetted to the second plurality of vias and to the corresponding plurality of solid metal balls.
Inventors:
Angela, Puzela
Crowder, Joseph M
Dupuis, Patricia S
Farika, Michael Sea
Crowder, Joseph M
Dupuis, Patricia S
Farika, Michael Sea
Application Number:
JP2004517589A
Publication Date:
May 12, 2010
Filing Date:
May 23, 2003
Export Citation:
Assignee:
RAYTHEON COMPANY
International Classes:
H05K1/14; H05K3/46; H01P3/08; H01P11/00; H05K3/36; H05K1/02; H05K3/32
Domestic Patent References:
| JP58140143A | ||||
| JP2001096795A | ||||
| JP3295266A | ||||
| JP8181450A |
Attorney, Agent or Firm:
Kazuo Shamoto
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Otsuka Naruhiko
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Otsuka Naruhiko