Title:
MULTILAYER SUBSTRATE AND ELECTRONIC EQUIPMENT USING THE SAME, METHOD FOR MANUFACTURING ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2014220309
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent cracks from being generated in a protective film.SOLUTION: The surface roughness of a side surface 63b of an outer edge pattern 63 is made lower than that of a part of inner edge patterns 61, 62 covered with a protective film 110. When electronic equipment having a mold resin 150 is manufactured by press-welding a mold 200 to a surface 10a side of a multilayer substrate 10 after mounting electronic parts 121 to 123 on a land 61, the protective film 110 covering the outer edge pattern 63 is press-welded to the mold 200. The protective film 110 is easily peeled from the side surface of the outer edge pattern 63 because the surface roughness of the side surface 63b of the outer edge pattern 63 is low. Therefore when the protective film 110 is peeled from the side surface 63b of the outer pattern 63, stress generated in the protective film 110 can be released, and it is possible to suppress generations of cracks in the protective film 110.
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Inventors:
YABUTA EIJI
IMADA SHINJI
IMADA SHINJI
Application Number:
JP2013097231A
Publication Date:
November 20, 2014
Filing Date:
May 06, 2013
Export Citation:
Assignee:
DENSO CORP
International Classes:
H05K3/28; H01L23/12; H05K3/46
Domestic Patent References:
| JP2000174171A | 2000-06-23 | |||
| JP2011066344A | 2011-03-31 | |||
| JP2012235166A | 2012-11-29 | |||
| JP2004281940A | 2004-10-07 | |||
| JP2009188086A | 2009-08-20 | |||
| JP2007318098A | 2007-12-06 |
Attorney, Agent or Firm:
Patent business corporation ゆうあい patent firm