To provide a method for manufacturing a multilayer substrate in which an electrical connection between layers is made perfect by inserting a protruding electrode into a conductive paste circuit provided to each layer when the multilayer substrate is formed, and to provide the multilayer substrate.
A first wiring board is provided by filling a basic material comprising a wiring groove corresponding to a through hole and a wiring pattern with a flexible conductive paste. A second wiring board, formed in the same manner as the first wiring board, is provided by filling a basic material comprising a wiring groove corresponding to a through hole and a wiring pattern with the flexible conductive paste. The protruding electrode is formed on a surface by printing the conductive paste on a through hole land of the first wiring board. By inserting and pressure-bonding the protruding electrode to the wiring pattern and the through hole land of the second wiring board, the first and second wiring boards are connected in the surface state.
NISHIMOTO KAZUTO
MIZUNO YASUHIRO
TERASAKI TATSU
Kyoko Kawamura
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