Title:
多層基板及び電子機器
Document Type and Number:
Japanese Patent JP7380953
Kind Code:
B2
Abstract:
In a first region, a multilayer body is bent along a first bending line such that a first main surface is located farther on an outer peripheral side than a second main surface. In a second region, the multilayer body is bent along a second bending line such that the first main surface is located farther on an inner peripheral side than the second main surface. In the first region, a first metal foil layer is located farther on an outer peripheral side than a center of the multilayer body. In the second region, a second metal foil layer is located farther on the outer peripheral side than the center of the multilayer body. In the second region, a distance between the second metal foil layer and the second main surface is shorter than a distance between the second metal foil layer and the first main surface.
Inventors:
Hironobu Takahashi
Fumiya Isono
Kenji Matsuda
Fumiya Isono
Kenji Matsuda
Application Number:
JP2023531811A
Publication Date:
November 15, 2023
Filing Date:
June 20, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K1/02; H05K3/38; H05K3/46
Domestic Patent References:
| JP555746A | ||||
| JP2011222664A |
Foreign References:
| WO2014065172A1 | ||||
| WO2019194142A1 |
Attorney, Agent or Firm:
Patent Attorney Kaede International Patent Office