Title:
MULTILAYER WIRING BOARD
Document Type and Number:
Japanese Patent JP3960208
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To easily manufacture a multilayer wiring board which integrally has a hard substrate body and a flexible substrate connected to the substrate body.
SOLUTION: The multilayer wiring board 1 is constituted in such a way that the flexible substrate 4 connecting the two hard substrate bodies 2 and 3 is integrally arranged in the two bodies 2 and 3 having conductor foil patterns and an interlayer connection parts between insulating layers of multiple layers. For manufacturing the multilayer wiring board 1, a substrate obtained by etching copper foil stuck to a film made of thermoplastic resin in a crystal transfer type, which becomes the insulating layer, and forming the conductor foil pattern is formed. The substrates are laminated, are heat-pressed and are integrated. A peeling part 8 which is formed of a solid pattern making a surface of conductor foil in a mirror finished surface, and which has low adhesiveness is arranged in a necessary part of the substrate. The whole multilayer wiring board 1 is formed in uniform thickness. The insulating layer 5 on a lower side is peeled at a peeling part 8 and an unnecessary part 9 is removed. Thus, the flexible substrate part 4 is formed.
Inventors:
Ogiso Ojibiko
Application Number:
JP2002333667A
Publication Date:
August 15, 2007
Filing Date:
November 18, 2002
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H05K3/46; H01P11/00; H05K1/02; (IPC1-7): H05K3/46; H01P11/00
Domestic Patent References:
| JP837373A | ||||
| JP2002232134A | ||||
| JP1051148A | ||||
| JP766557A | ||||
| JP61183998A | ||||
| JP62837U | ||||
| JP2002246718A | ||||
| JP669373A | ||||
| JP200194031A |
Attorney, Agent or Firm:
Tsuyoshi Sato