To provide a multilayer wiring board in which a warp of the multilayer wiring board formed on a metal substrate is reduced while maintaining radiation characteristics.

In a multilayer wiring board in which insulating resin layers and conductive wiring layers are alternately formed on one of the faces of a metal substrate having a purpose of improving radiating performance, by forming a mesh pattern resin layer 11 having openings 12 on the other face of the metal substrate 1, warp of the multilayer wiring board is reduced. Further, by forming a metal layer 14 on the whole face including the mesh pattern resin layer 11 and the openings 12, the radiation characteristics of the metal substrate are maintained.