Title:
MULTILAYERED CHIP ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3459945
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To surely prevent a solder filet from infiltrating from the width direction, up to both sides of terminal electrodes, and extending to both sides in the width direction and protruding outside.
SOLUTION: Several internal electrodes 10a, 10b, etc., each having a pull-out part 102 narrower than its main part 101 and several ceramic sheets 11a, 11b, etc., are stacked alternately. A ceramic element 1, which has square end faces having equal width and thickness and the pull-out parts 102 of the internal electrodes 10a, 10b, etc., exposed in square areas, which are in the inside of the outer edge of the end faces by an equal distance and are similar to the end faces. Narrow terminal electrodes 2 and 3 are provided for covering the end face regions, in which the pulling-out parts 102 of its internal electrodes 10a, 10b, etc., are exposed.
Inventors:
Taisuke Yasuhiko
Hiroki Sato
Hiroki Sato
Application Number:
JP2001238181A
Publication Date:
October 27, 2003
Filing Date:
August 06, 2001
Export Citation:
Assignee:
TDK Corporation
International Classes:
H01G4/30; H01C7/02; H01C7/10; (IPC1-7): H01G4/30
Domestic Patent References:
| JP2000277382A | ||||
| JP11186092A | ||||
| JP8222478A | ||||
| JP6215982A | ||||
| JP6112099A | ||||
| JP56110220A | ||||
| JP1156526U |
Attorney, Agent or Firm:
Kazuo Takeshita
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