Title:
MULTIWIRE SAW APPARATUS AND SLICING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP3163231
Kind Code:
B2
Abstract:
PURPOSE: To provide a multiwire saw apparatus capable of achieving the reduction in material cost and the enhancement of yield and work efficiency.
CONSTITUTION: A multiwire saw apparatus cutting a semiconductor ingot 13 into a large number of semiconductor wafers 13 by using wire rows provided at a predetermined interval under tension is equipped with a holding means 14 holding the semiconductor ingot 13 and a CO2 laser 15 cutting the semiconductor ingot 13 in the direction vertical to the cutting direction of wires 11.
Inventors:
Junzo Wakuta
Application Number:
JP6812595A
Publication Date:
May 08, 2001
Filing Date:
March 27, 1995
Export Citation:
Assignee:
Sharp Corporation
International Classes:
B28D5/04; H01L21/304; (IPC1-7): B28D5/04; H01L21/304
Domestic Patent References:
| JP61182761A | ||||
| JP5220731A | ||||
| JP60206590A |
Attorney, Agent or Firm:
Takaya Koike