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Title:
MUTILAYER-TYPE PROBE PIN AND PROBE CARD
Document Type and Number:
Japanese Patent JP2007256078
Kind Code:
A
Abstract:

To provide a multilayer-type probe pin and a probe card, capable of ensuring ample solder joint strength, even when using a lead-free solder, and capable of efficiently and surely carrying out soldering operation.

The multilayer-type probe pin being comprising a center member, an insulating layer for covering the center member, and a conductive metal layer formed on the outer circumference of the insulating layer, is such that the surface roughness Ra of the conductive metal layer is 30 μm or smaller, and that a conductive thin-film layer is formed on at least a portion of the surface of the conductive metal layer; and the probe card comprises by jointing the mutilayer-type probe thereto by using lead-free solder.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
YAMAMOTO SHINICHI
Application Number:
JP2006080848A
Publication Date:
October 04, 2007
Filing Date:
March 23, 2006
Export Citation:
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Assignee:
TOSHIBA CORP
TOSHIBA MATERIALS CO LTD
International Classes:
G01R1/067; G01R1/073; G01R31/26; H01L21/66
Domestic Patent References:
JP2006071357A2006-03-16
JP2002164106A2002-06-07
JP2004172378A2004-06-17
JPH0722268A1995-01-24
Attorney, Agent or Firm:
Kenji Yoshitake
Yukitaka Nakamura
Konno Akio
Noritaka Yokota