Title:
【発明の名称】ガラス-セラミック多層回路基板の製造方法
Document Type and Number:
Japanese Patent JP2584911
Kind Code:
B2
Abstract:
A process of producing a multiple-layer glass-ceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder mixture of a copper powder blended with a ceramic powder, the copper powder and the ceramic powder having a powder particle size providing a packing density comparable with or greater than that of the glass-ceramic green sheet when filled in the throughholes; printing a conductor paste on the green sheet having the throughholes filled with the powder mixture, to form a circuit conductor pattern on the green sheet; laminating a plurality of the green sheets having the conductor pattern formed thereon, to form a laminate body; heating the laminate body to thereby remove a binder therefrom and preliminary-fire the laminate body; and firing the preliminary-fired body.
Inventors:
SUZUKI HITOSHI
YAMAGISHI WATARU
NIWA KOICHI
HASHIMOTO KAORU
KAMEHARA NOBUO
YAMAGISHI WATARU
NIWA KOICHI
HASHIMOTO KAORU
KAMEHARA NOBUO
Application Number:
JP14613691A
Publication Date:
February 26, 1997
Filing Date:
June 18, 1991
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L23/15; H01L21/48; H05K3/40; H05K3/46; H05K1/03; H05K1/09; (IPC1-7): H05K3/46; H01L23/15
Domestic Patent References:
| JP319295A | ||||
| JP340490A | ||||
| JP51127112A |
Attorney, Agent or Firm:
Aoki Akira (4 outside)