PURPOSE: To prevent separation of an adhesive material and damage of an IC module, etc., occurring due to bending of an IC card.

CONSTITUTION: A recessed part is formed on one surface of a card base material 1. A cushioning member 12A is fixed by an adhesive material 13 on the bottom surface of the recessed part. A corner part which is the crossing part between the bottom surface 121A of the cushioning member 12A and a side wall surface 122A which is adjacent to said bottom surface is formed to have a specified roundness. In addition, an IC module 2 is fixed on the cushioning member 12A by an adhesive material 11. At the center of the adhesive material 11 and the cushioning member 12A, a rectangular window is provided, and a resin 23 is fitted in this window. When a force is added to an IC card 10 from the outside, bending stress is absorbed by the adhesive material 13 and the cushioning member 12A, and therefore, the stress which is added to the IC module 2 is reduced.