Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2525245
Kind Code:
B2
Abstract:
PURPOSE:To prevent a mounting of a heat sink from being limited by setting the thickness of a printed wiring board such that there can be secured upon fixing the heat sink an insulation distance between the surface of an insulating sealing resin on the side of the heat sink and a mounting part of a semiconductor device. CONSTITUTION:An end of a circuit pattern 22 of a printed wiring board 23 and lead eliminating 28, 29, 30, 31 are connected with each other, and semiconductor devices 20, 21 are mounted on the circuit pattern 22 to form a circuit, and further the printed wiring board 23 and parts of the lead terminals 28, 29, 30, 31 are sealed with an insulating sealing resin 32. Thereafter, a radiating plate 50 is mounted on the surface of the insulating sealing resin 320. Thereupon, the thickness D of the printed wiring board 23 is set such that an insulating distance can be kept between the surface of the insulating sealing resin 32 on the side of the heat sink 50 and the mounting part of the semiconductor devices 20, 21 upon mounting the heat sink 50.
Inventors:
YASHIRO JUJI
Application Number:
JP17260689A
Publication Date:
August 14, 1996
Filing Date:
July 03, 1989
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L23/28; H01L23/34; (IPC1-7): H01L23/28
Domestic Patent References:
| JP625645A | ||||
| JP63100755A |
Attorney, Agent or Firm:
Nakamura Tsunehisa