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Title:
SURFACE ACOUSTIC WAVE DEVICE
Document Type and Number:
Japanese Patent JPH0730362
Kind Code:
A
Abstract:

PURPOSE: To obtain the surface acoustic wave device which is easily made thin by forming a metallic film pattern on the top surface of a piezoelectric body substrate and providing an insulator, formed on this pattern, between patterns which generate a potential difference at the time of operation.

CONSTITUTION: The pattern 2b is formed of a metallic film on a pattern 2a, formed of a metallic film on the top surface of the piezoelectric material substrate 1, across the insulator 3. When the surface acoustic wave device operates, the potential difference is generated between those patterns 2a and 2b formed of the metallic films. Then the two patterns 2a and 2b formed of the metallic films are crossed across the insulator 3 which is sufficiently thick, so they can be crossed without any short-circuit. Complex wiring is therefore possible and they are planar, so the patterns which become complex can be simplified and reduced in size.


Inventors:
TERA YOSHIKO
Application Number:
JP17317593A
Publication Date:
January 31, 1995
Filing Date:
July 13, 1993
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H03H9/145; (IPC1-7): H03H9/145
Domestic Patent References:
JPH0316309A1991-01-24
JPH04281613A1992-10-07
JPH05167387A1993-07-02
JPH02104013A1990-04-17
JPH0334715A1991-02-14
JPH01231417A1989-09-14
Attorney, Agent or Firm:
Takada Mamoru



 
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