Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0513516
Kind Code:
A
Abstract:
PURPOSE: To obtain a method which can easily and stably perform collective bonding on an ultralarge number of pins at the time of manufacturing a tape carrier package.
CONSTITUTION: At the time of fixing the leads 4 of a tape carrier package to bumps 2 on a chip 1 by thermocompression bonding, a thermosetting resin film 5 is provided between the edge of the chip 1 and the bumps 2 so that the resin film 5 can fix the leads 4 to the bumps 2 when the film 5 melts due to the heat of a bonding tool 6 at the time of thermocompression bonding. In addition, an epoxy or silicone resin is used for forming the resin film 5.
Inventors:
KOBAYASHI KOICHI
Application Number:
JP16474791A
Publication Date:
January 22, 1993
Filing Date:
July 05, 1991
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/60; H01L21/603; (IPC1-7): H01L21/60; H01L21/603
Attorney, Agent or Firm:
Teiichi
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