Title:
【発明の名称】樹脂封止型半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP2596606
Kind Code:
B2
Inventors:
Tange Kosuke
Nobuhito Ouchi
Nobuhito Ouchi
Application Number:
JP1503789A
Publication Date:
April 02, 1997
Filing Date:
January 26, 1989
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
H01L21/56; H01L23/28; H01L23/50; (IPC1-7): H01L23/28; H01L21/56; H01L23/50
Domestic Patent References:
| JP59181025A | ||||
| JP2168655A |
Attorney, Agent or Firm:
Mamoru Shimizu (1 person outside)