Title:
【発明の名称】配線基板
Document Type and Number:
Japanese Patent JP3076527
Kind Code:
B2
Abstract:
The circuit board of the present invention makes the length of the conductor patterns shorter and improves the electric performance for the high speed signal processing. The circuit board of the present invention, which comprises a substrate, is characterized in that the substrate includes: a first face on which conductor patterns, which will be connected to a semiconductor chip, are formed; a second face on which a plurality of pads, on which terminals are formed, are matrically formed; and plated through holes whose one end are respectively opened in the conductor patterns and whose the other ends are respectively opened in the pads, wherein inner faces of the plated through holes are coated with plating layers so as to respectively electrically connect the conductor patterns with the pad.
Inventors:
Hisanobu Utsunomiya
Tanaka Tadahisa
Tanaka Tadahisa
Application Number:
JP3018097A
Publication Date:
August 14, 2000
Filing Date:
February 14, 1997
Export Citation:
Assignee:
Eastern Co., Ltd.
Interconnection Technologies Inc.
Interconnection Technologies Inc.
International Classes:
H01L23/12; H01L23/498; H01R12/00; H01R12/04; (IPC1-7): H01L23/12
Domestic Patent References:
| JP817964A |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)