Title:
【発明の名称】電子デバイスを包むためのパッケージ、該パッケージを組立てる方法、並びに該パッケージの組立てのためのキット
Document Type and Number:
Japanese Patent JP3016227
Kind Code:
B2
Abstract:
The present invention relates to a package (10) adapted to house an electronic device (12), such as a semiconductor integrated circuit. The package (10) components are comprised of aluminum or an aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.
Inventors:
Muffler, Deepak
Pop Ruwell, James M.
Pop Ruwell, James M.
Application Number:
JP51038289A
Publication Date:
March 06, 2000
Filing Date:
September 14, 1989
Export Citation:
Assignee:
Orin Corporation
International Classes:
H01L23/02; C25D11/04; H01L23/057; H01L23/06; H01L23/10; H01L23/14; (IPC1-7): H01L23/06; H01L23/02
Domestic Patent References:
| JP62174954A | ||||
| JP58147135A | ||||
| JP59161052A | ||||
| JP6318846U | ||||
| JP62134250U |
Attorney, Agent or Firm:
Akira Asamura (3 outside)