Title:
COAXIAL FLIP CHIP CONNECTION STRUCTURE AND FORMATION THEREOF
Document Type and Number:
Japanese Patent JP2541102
Kind Code:
B2
Abstract:
PURPOSE: To provide a minute, smaller-pitch, high-pin-count coaxial connection, ready for superhigh speed and less susceptible to leakage current, such as cross talk, through a simple manufacturing process, by coaxially forming a conductor layer for signalling, a first insulating layer, a conductor layer for grounding, and a second insulating layer in one electrode bump.
CONSTITUTION: The structure is an electrode structure of semiconductor elements mounted on a board using flip chip connection. Coaxial conductor layers 1 and 2 for signalling and grounding (GND) are formed in one electrode bump. In addition a first insulating layer 3 is formed between these conductor layers 1 and 2, and a second insulating layer 4 is formed outside the grounding (GND) conductor layer 2. The conductor (signalling) 1, first insulator 3, conductor (GND) 2 and second insulator 4 are formed in this order by spraying superfine grain material through a nozzle using a dispenser. A larger nozzle diameter is used in the formation of an outer layer than in inner layer formation.
Inventors:
YOKOYAMA KOJI
UCHIUMI KAZUAKI
KIMURA HIKARI
UCHIUMI KAZUAKI
KIMURA HIKARI
Application Number:
JP15162793A
Publication Date:
October 09, 1996
Filing Date:
June 23, 1993
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/321; H01L21/60
Domestic Patent References:
| JP61296750A | ||||
| JP430544A | ||||
| JP4237149A | ||||
| JP53183A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)