RADIATION CURABLE HOT MELT PRESSURE SENSITIVE ADHESIVE

Title:

RADIATION CURABLE HOT MELT PRESSURE SENSITIVE ADHESIVE

Document Type and Number:

Japanese Patent JPH073234

Kind Code:

A

Abstract:

PURPOSE: To obtain a radiation curable hot melt pressure sensitive adhesive for acrylic substrates.

CONSTITUTION: The hot melt pressure sensitive adhesive is formed by copolymerizing acrylic, or a combination of acrylic and vinyl monomers with a functional monomer, 1-(1-isocyanato-1-methylethyl)-3-(1-methylethenyl)benzene, m-TMI, to give a saturated polymer with pendant vinyl groups that are crosslinked by UV or EB radiation.

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Inventors:

RAMA CHIYANDORAN
RUUPURAN RAMUHARATSUKU
AAUIN JIEI DEIBISU
JIYON SHII REITON

Application Number:

JP859094A

Publication Date:

January 06, 1995

Filing Date:

January 28, 1994

Export Citation:

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Assignee:

NAT STARCH CHEM INVEST

International Classes:

C08F8/30; C08F290/00; C08F299/00; C08G18/62; C08G18/81; C09J7/02; C09J133/04; C09J133/06; (IPC1-7): C09J133/06; C09J7/02; C09J133/06

Domestic Patent References:

JPH04270774A	1992-09-28
JPH02102216A	1990-04-13

Attorney, Agent or Firm:

Takashi Ishida (3 others)

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