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Title:
COPPER ALLOY FOR ELECTRONIC APPLIANCE AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JPH0718355
Kind Code:
A
Abstract:

PURPOSE: To obtain a Cu alloy suppressed in magnetization while making use of superior strength and high electric conductivity peculiar to a conventional Cu-Fe alloy and having high strength and high electric conductivity as a Cu-Fe alloy having a low Fe content.

CONSTITUTION: This Cu alloy for electric appliances consists of 5-12wt.% Fe, 0.01-1.0wt.% P and/or 0.01-1.0wt.% Zn and the balance Cu and preferably contains 0.01-1.0wt.%, in total, of one or more among Si, Mn and Mg and 0.001-1.0wt.%, in total, of one or more among Al, Pb, As, Sb, B, Co, Te, In, Ti, Zr, Hf, Ag and Ge. The Cu alloy is produced by melting and solidifying this components.


Inventors:
KUBOZONO KENJI
KAWABATA TOSHIKAZU
HASHIZUME KIMIO
MAEDA AKIRA
KITAKAZE KEIZO
Application Number:
JP16171993A
Publication Date:
January 20, 1995
Filing Date:
June 30, 1993
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B22D11/00; C22C9/00; C22F1/00; C22F1/08; (IPC1-7): C22C9/00; B22D11/00; C22F1/08
Domestic Patent References:
JPS6121293B21986-05-26
JPH02111850A1990-04-24
JPH03294459A1991-12-25
Attorney, Agent or Firm:
Soga Doteru (6 people outside)