WIRE-BONDING METHOD OF COVERED WIRE AND SEMICONDUCTOR DEVICE

Title:

WIRE-BONDING METHOD OF COVERED WIRE AND SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JPH0513491

Kind Code:

A

Abstract:

PURPOSE: To enable a joint of a covered wire and an outer lead to be enhanced in bonding strength.

CONSTITUTION: After a covered wire 1 is bonded to an outer lead B by pressing, the tip of a wire 2 is melted to form a ball, the ball formed at the tip of the wire 2 is bonded to a joint C between the outer lead B and the covered wire 1 by pressure and cut off from the wire 2 to form a bump 2b, and the joint C is covered with the bump 2b. The bump 2b is formed spreading over the end of the covered wire 1 bonded to the outer lead B and its vicinity, so that a covering layer 1b left between a core wire 1a and the surface of the outer lead B is removed by the heat released at the formation of the bump 2b, and joint surface of the covered wire to the surface of the outer lead B is enlarged.

Inventors:

KAWAGUCHI HIDEAKI

Application Number:

JP32883691A

Publication Date:

January 22, 1993

Filing Date:

December 12, 1991

Export Citation:

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Assignee:

TANAKA ELECTRONICS IND

International Classes:

H01L21/60; (IPC1-7): H01L21/60

Attorney, Agent or Firm:

Hayakawa Masaname

Next Patent: WIRE BONDING BALL FORMING DEVICE