Title:
HYBRID INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPH0562723
Kind Code:
A
Abstract:
PURPOSE: To improve test reliability by highly accurately measuring voltage at places, to which a large current is supplied, of a thick film substrate in a hybrid integrated circuit device.
CONSTITUTION: A shape of a lead-attached land 4, at a place to which a large current is supplied, is made nearly twice of a former shape, two leads 2 similar to a former one are connected to such a lead-attached land 4, and either of the two leads is made a force pin and the other a sense pin, allowing Kelvin connection. The Kelvin connection is easily accomplished, improving measurement reliability in a test process.
Inventors:
MIYAMOTO MASAKI
SUGIMOTO IHEI
SUGIMOTO IHEI
Application Number:
JP22282791A
Publication Date:
March 12, 1993
Filing Date:
September 03, 1991
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01R1/06; G01R31/02; H01L23/50; H05K1/11; H05K1/02; (IPC1-7): G01R1/06; G01R31/02; H01L23/50; H01R9/09; H05K1/11
Domestic Patent References:
| JPS58131205A | 1983-08-05 | |||
| JPS61187062A | 1986-08-20 |
Attorney, Agent or Firm:
Mamoru Takada (1 person outside)
Next Patent: SLIP WAVE VIBRATING UNIT