Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0669086
Kind Code:
A
Abstract:
PURPOSE: To determine the position of a chip inside a wafer by detecting the state of a fuse element which can be cut being matched to the position of the chip and outputting it externally.
CONSTITUTION: By cutting a fuse element 1 according to the position of a chip inside a wafer, the output of a 2-input NAND gate 7 changes according to the state of the fuse element 1 when a TEST signal is set to a high level and the output signal is output externally, thus determining the position inside the wafer.
Inventors:
TANAKA AKIHITO
Application Number:
JP21757392A
Publication Date:
March 11, 1994
Filing Date:
August 17, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/02; H01L21/66; H01L21/68; H01L21/82; (IPC1-7): H01L21/02; H01L21/66; H01L21/68; H01L21/82
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
Next Patent: METHOD FOR FORMING SILICON SUBSTRATE