Title:
【発明の名称】半導体装置のリード矯正装置及び方法
Document Type and Number:
Japanese Patent JP3063806
Kind Code:
B2
Inventors:
Toshio Komiya
Application Number:
JP2336592A
Publication Date:
July 12, 2000
Filing Date:
January 14, 1992
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP6232547U |
Attorney, Agent or Firm:
Hideki Yamamoto