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Patent Searching and Data


Title:
INJECTION HOLLOW MOLD
Document Type and Number:
Japanese Patent JPH054259
Kind Code:
A
Abstract:

PURPOSE: To surely pour hollow-forming fluid in synthetic resin and prevent the fluid from leaking.

CONSTITUTION: A groove 31 is provided around a fluid pouring port 10, through which hollow forming fluid 930 is poured. Further, a recessed part 71 is provided between the groove 31 and a runner 21. At the pouring of the fluid, the fluid tends to escape along the boundary between a mold 62 and the synthetic resin in the runner 21. However, due to the solidified layer of synthetic resin formed in the groove 31, resistance develops in the fluid. As a result, by the groove and the recessed part 71, the flow path of the resin is connected to the synthetic resin in the runner 21.


Inventors:
BABA NOBUYOSHI
Application Number:
JP18313091A
Publication Date:
January 14, 1993
Filing Date:
June 27, 1991
Export Citation:
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Assignee:
TOYODA GOSEI KK
International Classes:
B29C45/00; B29C45/17; B29C45/26; B29C49/06; B29C49/48; B29L22/00; (IPC1-7): B29C45/00; B29C45/26; B29C49/06; B29C49/48; B29L22/00
Attorney, Agent or Firm:
Yoshiyasu Takahashi