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Title:
METHOD AND DEVICE FOR SHAPING AND INSTALLING ANNULAR SOLDER
Document Type and Number:
Japanese Patent JPH0740155
Kind Code:
A
Abstract:

PURPOSE: To provide a method and device for shaping a soldering wire rod which is soft and has the exceedingly low elasticity limit to an annular solder free from deformation and carrying out transfer and assembly without deforming the shape.

CONSTITUTION: A soldering wire rod W is drivien out by a pair of feeding rollers 14 and 14, and after the slodering wire rod 14 is allowed to pass by a prescribed length in the stop hole 21a on a shearing tool 21, the shearing tool 21 is advanced to shear the wire rod by a prescribed length, and after the transfer to a shaping position 30, a shaping punch 35 is advanced at the position opposed to the stop hole 21a, and the soldering wire rod W is pressed, and a spiral annular body is shaped in the space formed by the spiral shaping groove formed on a shaping die 31 and the outer periphery of a shaping shaft 32, and a spiral solder is formed. The spiral solder is pressed by a shaping cylinder 33, and nipped between the shaping shaft 32 and the stop shaft 41, guided by the shaping shaft 32, and the solder is fitted into a soldered joint assembly body in waiting, and the annular solder is formed, and assembled at a prescribed position.


Inventors:
KURIYAMA CHUSAKU
Application Number:
JP20865793A
Publication Date:
February 10, 1995
Filing Date:
July 31, 1993
Export Citation:
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Assignee:
KURIYAMA CHUSAKU
International Classes:
B23P19/02; (IPC1-7): B23P19/02



 
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