Title:
DEVICE APPLIED WITH METAL CAP HAVING THIN HOLE
Document Type and Number:
Japanese Patent JPH0722275
Kind Code:
A
Abstract:
PURPOSE: To accelerate degassing when a conductive adhesive composed of an epoxy resin, for example, is cured by making thin holes in the metal cap.
CONSTITUTION: A chip device element is fitted, at the opposite ends thereof, with metal caps through conductive adhesive. The metal cap 3 is provided with thin holes. This structure accelerates degassing at the time of curing of the conductive adhesive to ensure positive curing. Furthermore, insufficient curing is eliminated under normal pressure and thereby excellent metal capped devices can be mass produced.
Inventors:
TOKUMARU TATSUO
Application Number:
JP15047093A
Publication Date:
January 24, 1995
Filing Date:
June 22, 1993
Export Citation:
Assignee:
NEC CORP
International Classes:
H01G4/248; H01G4/12; H01G4/30; H01R4/04; (IPC1-7): H01G4/248; H01G4/12; H01G4/30; H01R4/04
Domestic Patent References:
| JP4025221B |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
Next Patent: 時間多重通信ネットワークの通信方法