Title:
METHOD AND DEVICE FOR MANUFACTURING PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3049984
Kind Code:
B2
Abstract:
PURPOSE: To provide a method for manufacturing printed circuit board which can extremely reduce the electrostatic capacity of an insulation layer consisting of insulation resin to obtain the printed circuit board for multichip module operating at a high frequency.
CONSTITUTION: After an insulation resin 3 is applied to printed circuit board 1 in a high-pressure container 9 where the internal atmospheric pressure is maintained to be high, the pressure inside the container 9 is reduced, thus generating air bubbles 8 in the insulation resin 3. Therefore, the electrostatic capacity of the insulation resin 3 becomes extremely small due to the presence of the air bubbles 8 and the propagation delay of the signal in the circuit system provided on the resin 3 can be reduced extremely. thus achieving a multi-chip module operating at a high frequency.
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Inventors:
Tomohiro Tamaki
Kenzo Hatada
Kenzo Hatada
Application Number:
JP3918093A
Publication Date:
June 05, 2000
Filing Date:
March 01, 1993
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K1/03; H05K3/00; (IPC1-7): H05K1/03; H05K3/00
Domestic Patent References:
| JP61182296A | ||||
| JP6141151A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)