Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3048722
Kind Code:
B2
Abstract:
PURPOSE: To avoid short circuit between connecting terminals for electrical connection to outer equipment.
CONSTITUTION: A solder resist layer 5 is formed on a board 1 excluding the formation region 6 of connecting terminals 3 for electrical connection to outer equipments. Respective connecting terminals 3 are coated with a protective film 7 comprising a conductive carbon ink. The protective film 7 is spaced from the end part of the solder resist layer 5 at a specific interval. Since the protective film 7 is coated only on the thickness part of the connecting terminals 3 for minimizing the step, the conductive carbon ink can be prevented from oozing out thereby prevented the short circuit between the connecting terminals 3 due to the oozing. Finally, the space between the protective layer 7 and the solder resist layer 5 is coated with an insulating over-coat layer 8 to protect the exposed part of the connecting terminals 3 from being oxidized.
Inventors:
Shin Kawakami
Hayashida Tatsuhiko
Mitsuo Nakahara
Hayashida Tatsuhiko
Mitsuo Nakahara
Application Number:
JP34827791A
Publication Date:
June 05, 2000
Filing Date:
December 04, 1991
Export Citation:
Assignee:
CMK Japan Co., Ltd.
International Classes:
H05K1/11; H05K3/28; H05K3/40; H05K3/24; H05K3/34; (IPC1-7): H05K3/28; H05K1/11; H05K3/40
Domestic Patent References:
| JP63271997A | ||||
| JP645096A |
Attorney, Agent or Firm:
Miyuki Ariga (5 people outside)