PURPOSE: To increase the connection strength of thin metal wires at a relay part for connecting an electrode on a semiconductor element with the internal lead of a lead frame through the thin metal wires in such a way as to relay the connection between the electrode and the internal lead at the relay part.

CONSTITUTION: The other end of a thin metal wire 6 from an internal lead 2 of a lead frame is superposed on the other end of a thin metal wire 5 from an electrode on a semiconductor element 4 on a semiconductor element mounting part 1 on a bonding pad 3a on an insulator layer 3 of a relay part between the electrode and the internal lead 2 and the wires 6 and 5 are made a bonding connection to each other along with the pad 3a. Accordingly, as both wires 6 and 5 are superposed and are connected to the pad 3a, a disconnection of continuity between the element 4 and the internal lead is not caused even if the wires 6 and 5 are exfoliated from the pad 3a.