Title:
【発明の名称】半導体集積回路装置
Document Type and Number:
Japanese Patent JP2580222
Kind Code:
B2
Inventors:
KUBONO SHOJI
Application Number:
JP33600087A
Publication Date:
February 12, 1997
Filing Date:
December 29, 1987
Export Citation:
Assignee:
HITACHI SEISAKUSHO KK
HITACHI CHO ERU ESU AI ENJINIARINGU KK
HITACHI CHO ERU ESU AI ENJINIARINGU KK
International Classes:
G11C11/403; G11C11/34; G11C11/406; G11C11/407; H03K3/354; (IPC1-7): G11C11/407; G11C11/403; H03K3/354
Attorney, Agent or Firm:
Tokuwaka Mitsumasa