【発明の名称】密封多極絶縁端子構造体の製造方法

Japanese Patent JP3061523

B2

PURPOSE:To maintain airtightness under a high temperature and a high pressure condition by mixing a glassy powder and mica powder as the sealing member, molding it roughly and using that which is made to be a ceramic under the high temperature and high pressure condition. CONSTITUTION:A glassy powder and mica powder are mixed (the ratio is 30-50:50-70wt.%) for the sealing member 1a. The mixture is molded roughly, heated, made to be a ceramic. For instance, a rough mold sealing member 1a, a monitoring disk 2, and a separate template 3 are set on a lower mold 8 for a mold. And after a sleeve part 5 and an upper mold 9 for the mold are set, a conductor 4 is inserted. It is put in a heating furnace and after the temperature of the sleeve member 5 detected by a thermocouple stuck on the surface of the sleeve member 5 reaches 50-550 deg.C, it is held for about 30 minutes to be soaked. Next, in a high temperature state, pressurization and molding are performed for 5 minutes under a pressure of 230-280kg/cm<2>. After the pressurization and molding, natural cooling is conducted down to 200 deg.C and the upper and the lower molds 8, 9 for the mold are removed.

Yukinobu Uomoto
Noriaki Fujii
Yasuhiko Ikeda
Isao Yoshinaga
Edashima Toshikazu
Tadanori Murakami
Kazuharu Kato
Hiroshi Adachi

JP2960594A

July 10, 2000

February 28, 1994

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Ryoden Kasei Co., Ltd.
Mitsubishi Electric Corporation

G21D1/00; G21C13/036; H02G3/22; (IPC1-7): G21C13/036; H02G3/22

JP6269114A
JP638341A
JP611618A
JP5161235A
JP568316A
JP545488A
JP4315413A
JP247589A
JP1200586A
JP216038U

Kaneo Miyata (2 outside)

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