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Title:
DEVICE FOR COOLING ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JPH0637215
Kind Code:
A
Abstract:

PURPOSE: To prevent positional deviation of an internal heat conduction device without increasing the number of component parts needed by a method wherein one of protrusions of an elastic member is inserted and fixed to the groove of the second fin, other protrusion is inserted into the groove of the first fin while it is being made eccentric to either of the directions in parallel with a slit, and the first fin and the second fin are engaged.

CONSTITUTION: Slits 11 and 11 are provided in the right-angled direction of the first fin 6 on the side of a base 4 and the second fin 8 on the side of a housing 9, a spring 10 is inserted in the slits 11 and fixed to the side of the housing 9 using protrusions 12 and 12. Also, the protrusion 13 provided on the spring 10 is made eccentric from the center line of the spring 10, the protrusion 13 is inserted between the fins 6 on the side of a heat conducting material 4, and as a result, the fins 6 are pressed to the lateral direction by the protrusions 13. Consequently, the spacings between the fins 6 and the fins 8 are minimized, and heat transfer efficiency is improved. On the other hand, as the movement of the spring 10 is restricted by the wall of the slits 11, the positional relation between the spring 10 and an LSI chip 1 is determined. Accordingly, the error in working and assembling can be reduced, and productivity can also be improved.


Inventors:
KAWAMURA KEIZO
OGURO TAKAHIRO
SASAKI SHIGEYUKI
Application Number:
JP18655992A
Publication Date:
February 10, 1994
Filing Date:
July 14, 1992
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01L23/36; (IPC1-7): H01L23/36
Attorney, Agent or Firm:
Yukihiko Takada



 
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