Title:
【発明の名称】半導体チップ吸着用ツール及び該ツールを用いた半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3092585
Kind Code:
B2
Inventors:
Shunji Noguchi
Application Number:
JP10745698A
Publication Date:
September 25, 2000
Filing Date:
April 17, 1998
Export Citation:
Assignee:
NEC
International Classes:
H01L21/677; H01L21/60; H01L21/68; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Yukio Nishimura