Title:
RESIN MOLDING METAL MOLD OF SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP3032335
Kind Code:
B2
Abstract:
PURPOSE: To provide a positioning method wherein its productivity and its yield can be enhanced when a semiconductor wafer is resin-molded and to provide a resin molding metal mold.
CONSTITUTION: The title metal mold is constituted in the following manner: a semiconductor wafer is sandwiched and held while it is supported by a lower- mold holder 31 arranged so as to be aligned with the molding center of a molding unit via a center guide pin 35 installed in a lower-mold heater block 34 attached to the molding unit which molds a resin to the outer circumferential edge of the semiconductor wafer.
Inventors:
Hajime Shaura
Minohoshi Tomio
Mitsuo Sato
Minohoshi Tomio
Mitsuo Sato
Application Number:
JP22281391A
Publication Date:
April 17, 2000
Filing Date:
September 03, 1991
Export Citation:
Assignee:
Toshiba Corporation
Toshiba Microelectronics Corporation
Toshiba Microelectronics Corporation
International Classes:
H01L21/02; (IPC1-7): H01L21/02
Domestic Patent References:
| JP3234605A |
Attorney, Agent or Firm:
Hidekazu Miyoshi (4 outside)