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Title:
NEGATIVE PHOTOSENSITIVE ELECTRODEPOSITION COATING RESIN COMPOSITION AND PRODUCTION OF ELECTRODEPOSITION BATH AND RESIST PATTERN USING THE COMPOSITION
Document Type and Number:
Japanese Patent JPH0643644
Kind Code:
A
Abstract:

PURPOSE: To stabilize an electrodeposition bath, to improve the electrodepositing property and to obtain an electrodeposited film having uniform thickness and good appearance by incorporating a specified compd. into the composition.

CONSTITUTION: This composition contains a polymer obtained by neutralizing a coplymer of an acrylic acid and/or a methacrylic acid having 20-300 acid value with a basic org. compd., a nonwater-soluble monomer having ≥2 photopolymeriable unsaturated bonds in the molecule, a non-water-soluble optical initiator and a compd. shown by formula I or II. In the formulas, R1 is hydrogen atom, halogen atom, hydroxyl, alkyl or alkoxyl, R2 is hydrogen atom, hydroxyl, alkyl, phenyl or -Z-R3, Z is alkylene group, cycloalkylene group or alkylene ether group, R3 is hydroxyl, alkoxyl, etc., Y is the salt of the carboxyl group, (n) is an integer of 1 to 3 and may be 0 when the R2 has the salt of carboxyl, and R4 has the same significance as R2.


Inventors:
UEHARA HIDEAKI
AMANOKURA HITOSHI
TACHIKI SHIGEO
KATO TAKURO
TSUKADA KATSUSHIGE
YAMAZAKI YUJI
TAKAHASHI TOSHIYA
SHIOTANI TOSHIHIKO
NAGASHIMA YOSHIHISA
Application Number:
JP4794593A
Publication Date:
February 18, 1994
Filing Date:
March 09, 1993
Export Citation:
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Assignee:
DAINIPPON TORYO KK
HITACHI CHEMICAL CO LTD
International Classes:
C08F2/50; C09D5/44; C25D13/00; C25D13/06; G03F7/004; G03F7/027; G03F7/028; G03F7/038; G03F7/085; H01L21/027; H05K3/00; (IPC1-7): G03F7/038; C09D5/44; C25D13/00; C25D13/06; G03F7/004; G03F7/027; G03F7/028; H01L21/027; H05K3/00
Attorney, Agent or Firm:
Kunihiko Wakabayashi