PURPOSE: To provide a light emitting diode lamp which can improve the work efficiency at the time of sealing a reflection type light emitting diode with resin.

CONSTITUTION: Three pieces of light emitting diodes arrays 1 are arranged in three rows on a board 51, and it is accommodated in a lamp case 53. The front face of the lamp case 53 including the emitting face 1 of the light emitting diode 1 of the light emitting diode array 1 is covered with an adhesive tape 57, which has heat resistance and light transmittance, without space. Black epoxy resin is injected from the rear side of the lamp case 53, with the front of the lamp case 53 downward, and it is defoamed in vacuum. After the resin is applied over the whole of the light emitting diode array 1 and the board 51, the resin is cured inside a drying furnace at approximately 80°C. The adhesive tape 57 constitutes one part of the light emitting diode lamp as it is.