Title:
【考案の名称】穴加工工具
Document Type and Number:
Japanese Patent JPH0737531
Kind Code:
U
Inventors:
Takayuki Serizawa
Application Number:
JP6663693U
Publication Date:
July 11, 1995
Filing Date:
December 14, 1993
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO.,LTD.
International Classes:
B23B51/00; B23D77/14; (IPC1-7): B23D77/14; B23B51/00
Attorney, Agent or Firm:
Masatake Shiga (2 outside)
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