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Title:
【発明の名称】電子部品実装装置
Document Type and Number:
Japanese Patent JP2512114
Kind Code:
B2
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Inventors:
HIDESE WATARU
Application Number:
JP28454188A
Publication Date:
July 03, 1996
Filing Date:
November 10, 1988
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/52; H05K13/04; (IPC1-7): H01L21/52; H05K13/04
Domestic Patent References:
JPS61131537A
Attorney, Agent or Firm:
Tomoyuki Takimoto



 
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