PURPOSE: To improve solderability by bending the projected portion of lead wire at the right angle and then providing the lead wire along a plate type base sheet in manufacture a chip type electrolytic capacitor.

CONSTITUTION: A pair of lead wires 2, 3 led from the end face of an electrolytic capacitor body are led through a through-hole of a plate type base sheet 4 arranged at the end face hermetically sealed with a sealing material. The protected portions of the lead wires 2, 3 are processed in the form of flat shape and recessed and projected portions 9 are formed at the surface of the lead wires 2, 3 being in contact with a printed circuit board. Thereafter, the projected portions of the lead wires 2, 3 are bent at the right angle and are then laid along the surface of the plate type base sheet 4.