Title:
INTEGRATED CIRCUIT PACKAGE AND ASSEMBLY STRUCTURE THEREOF
Document Type and Number:
Japanese Patent JPH0714944
Kind Code:
A
Abstract:
PURPOSE: To perform improved heat management and control with respect to electromagnetic interferences by providing an electromagnetic shielding and heat radiating means, having a laminated construction of a plurality of layers composed of a heat-conducting material layer, and a magnetic material layer and a conductive grounding layer on a dielectric section. CONSTITUTION: This package is composed of a body 14, consisting of a board section 15 and a dielectric section 18. An integrated circuit 12 is surrounded by a conductive member, extending to the outside of the body 14 from the integrated circuit 12 through the medium of the dielectric section 18 of this body 14. Especially on the dielectric part 18, an electromagnetic shielding and heat-radiating means which have a laminated construction of a plural layers composed of heat-conducting material layers 32, 36, a magnetic material layer 34 having a large permeability with respect to electromagnetic radiation generated from the integrated circuit 12. At least one conductive grounding layer 31 is provided. Consequently, it becomes possible to obtain a package of electromagnetic shielding and heat-radiating construction, capable of effectively reducing thermal radiation and electromagnetic radiation.
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Inventors:
GABURIERU MARUKANTONIO
KAAN NIYUUEN
KAAN NIYUUEN
Application Number:
JP9823694A
Publication Date:
January 17, 1995
Filing Date:
April 11, 1994
Export Citation:
Assignee:
NORTHERN TELECOM LTD
International Classes:
H01L23/06; H01L23/12; H01L23/28; H01L23/31; H01L23/34; H01L23/373; H01L23/433; H01L23/495; H01L23/552; H05K1/02; (IPC1-7): H01L23/12; H01L23/06; H01L23/28; H01L23/34
Attorney, Agent or Firm:
Izumi Kazuto
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