STYRENE-BASED FOAMABLE RESIN PARTICLE AND FOAMED MOLDING OBTAINED BY USING THE SAME

Japanese Patent JP3024522

B2

PROBLEM TO BE SOLVED: To obtain the subject particle using a high-molecular weight base resin having a great number of voids in the interior, preexpanding the resin, then molding the preexpanded resin, providing a foamed molding excellent in mechanical strengths and having sufficient fusing property.
SOLUTION: This styrene-based foamable resin particle comprises a base resin having ≥250 voids (a size of preferably 0.2-20μm)/mm2, preferably 500-10,000 voids/mm2 on a section passing through the vicinity of the center of the styrene-based foamable resin particle and 250,000-1,000,000, preferably 350,000-500,00 weight-average molecular weight. In order to make a great number of voids in the particle, a method for making the styrene-based foamable resin particle take water during suspension polymerization, etc., are preferable. To be concrete, for example, a large amount of a surfactant, etc., is added during suspension polymerization. In order to effectively generate voids with a small amount of a surfactant, a cooling time of the polymerization product is made within 9 hours. The high molecular weight styrene-based foamable resin particle is preferably obtained by a seed polymerization method using a small particle of a previously polymerized styrene-based polymer.

Tomomichi Ito
Hiroki Shinozaki
Ueda Yonezo

JP22795595A

March 21, 2000

September 05, 1995

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Mitsubishi Chemical BASF Co., Ltd.

C08J9/16; C08F2/18; C08F12/00; C08J9/228; (IPC1-7): C08J9/16; C08F2/18

JP8295757A
JP58109539A
JP971679A
JP7292150A

【文献】久布白 兼三著「発砲ポリスチレンのすべて」(1995年5月1日)マーティック株式会社発行 第35~39頁

Koji Hasegawa

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