Title:
【考案の名称】ワッシヤーシールの取付構造
Document Type and Number:
Japanese Patent JPH088335
Kind Code:
Y2
Inventors:
Kenji Matsumoto
Application Number:
JP4195191U
Publication Date:
March 06, 1996
Filing Date:
March 26, 1991
Export Citation:
Assignee:
Uchiyama Industry Co., Ltd.
International Classes:
F02F11/00; F16B31/02; F16B43/00; (IPC1-7): F16B43/00; F02F11/00; F16B31/02
Domestic Patent References:
| JP60161714U | ||||
| JP5748318U |
Next Patent: SEMICONDUCTOR DEVICE AND FABRICATION THEREOF